Metrology, Inspection and Fault Isolation in Semiconductor Industry

Metrology and Inspection for Yield Engineering

Microscopy (Visible Light Microscopy, SEM, TEM, FIB), X-ray Techniques

Workflows for Fault Isolation and Physical Failure Analysis (PFA)

Destructive and Nondestructive Techniques

Leading-edge Technology Nodes: Wafer-level Processes and Advanced Packaging

Structure and Defect Imaging